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Tektronix Component Solutions: Wire Bonding Services

Wire bonding has proven to be a dominant interconnect technology due to its versatility, performance and reliability. Recent advances in ultra-fine-pitch wire bonding services have allowed for package-size reduction while providing higher interconnect densities. Additionally, wire bonding can be accomplished on a variety of substrates, ranging from PCBs to multi-layer and thick-film ceramics to flexible circuits, offering a dynamic interconnect solution.

Advanced wire bonding services are a core competency at Tektronix Component Solutions. We utilize both gold and aluminum wire bond materials and can support multi-row and high-density interconnect requirements. Additionally, we have well-established capabilities in thermosonic ball-stitch wire bonding, thermocompression ball-stitch wire bonding, thermosonic wedge bonding, ultrasonic wedge bonding and ribbon bonding.

Wire Bonding Process Capabilities:

Ball-stitch bonding (thermosonic and thermocompression):

Process CapabilitiesUnitsRoutineSpecial

Wire Diameter

mils

0.8, 1, 1.2

0.7

IC Bond Pad Dimensions

µm

65 x 65

50 x 50

IC Bond Pad Pitch - Inline (min)

µm

80

75

IC Bond Pad Pitch - Staggered (min)

µm

150

125

Wirebond Length (min)

mm

1

0.4

Wirebond Length (max)

mm

3

4

Wedge bonding (thermosonic and ultrasonic)

Process CapabilitiesUnitsRoutineSpecial

Wire Diameter

mils

0.8, 1

0.7

Ribbon Width

mils

2-3

8

Bond Finger - Au Plating Thickness (min)

µin

35

75

IC Bond Pad Dimensions (min)

µm

65 x 65

50 x 50

IC Bond Pad Pitch - Inline (min)

µm

100

80

IC Bond Pad Pitch - Staggered (min)

µm

150

125

Wirebond Length (min)

mm

1

0.4

Wirebond Length (max)

mm

3.75

5