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ТИП ЗАГРУЗКИ
МОДЕЛЬ ИЛИ КЛЮЧЕВОЕ СЛОВО

The overwhelming popularity of smart phones, and their insatiable demand for bandwidth to support streaming video and applications, has network operators looking to equipment suppliers for high-speed solutions to expand the capacity of their networks.

Accomplishing that goal requires high-performance microelectronics to enable the advanced capabilities of next generation systems, and a development partner who is a leader in the field.

Tektronix Component Solutions is an expert at high-performance microelectronic development and has proven capabilities serving high-speed communications applications – including 40G and 100G commercial applications as well as military applications. Our broad base of capabilities is well-suited for the requirements of communication system manufacturers. With experience and capabilities that span advanced electro-optical modules, customizable high-frequency Ball Grid Array (BGA) and Leadless Chip Carrier (LCC) IC packaging platforms, high-speed data converters and wideband ASIC design services, Tektronix Component Solutions is the microelectronics partner you can trust to enable your next generation communications systems.

Electro-Optical Modules

We provide turnkey capabilities for electro-optical modules – including design, assembly and test services. Previous experience includes development of a proprietary prism that bends the optical path to enable a lower product profile for an optical transceiver device. For that same product, Tektronix Component Solutions used a custom six axis alignment system for active alignment of the optics and developed an electro-optical test suite capable of testing up to four receiver channels simultaneously.

Adding to our expertise in electro-optical module development, we have advanced capabilities in optical interconnect technologies. Our capabilities include, but are not limited to:

High-Performance IC Packaging

Tektronix Component Solutions’ high-performance packaging capabilities enable the development of next-generation communications systems. Our customizable 15 and 30+ GHz BGA and 40+ GHz LCC package platforms, qualified specifically with the needs of communications customers in mind, shorten the development cycle for high-performance ASIC packages, improving time-to-market for high-speed communications product deployment.